Meeting current and future wafering challenges.
In: Solid State Technology, Jg. 52 (2009-03-01), Heft 3, S. 32-35
Online
academicJournal
Zugriff:
The article focuses on the production cost in using the multi-wire slurry sawing (MWSS) technique in the semiconductor industry in the U.S. The use of the MWSS has been perceived as a solution to reduce silicon consumption during the cutting of semiconductor wafers. This method is considered to reduce production cost while achieving the high quality demand on wafer in the photovoltaic (PV) industry.
Titel: |
Meeting current and future wafering challenges.
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Autor/in / Beteiligte Person: | Nasch, Philippe M. ; Sumi, Romain |
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Zeitschrift: | Solid State Technology, Jg. 52 (2009-03-01), Heft 3, S. 32-35 |
Veröffentlichung: | 2009 |
Medientyp: | academicJournal |
ISSN: | 0038-111X (print) |
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