Entwicklung keramischer Vergussmassen mit Alkoxysilanen zur Steigerung der Haftfestigkeit
KIT Scientific Publishing, 2023
Online
E-Book
- 220
The adhesion of encapsulation materials is an dendrimental factor for the robustness and functionality of a power electronic device. In this work the adhesion of ceramic potting materials was developed. A new primer was invented, that enabled high shear strengths even at high temperatures for short times. Furthermore, a completely new potting material was invented on the basis of alkoxysilanes. Especially MTES showed beneficial properties for the adhesion under temperature load.
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Entwicklung keramischer Vergussmassen mit Alkoxysilanen zur Steigerung der Haftfestigkeit
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Autor/in / Beteiligte Person: | Kohler, Tobias |
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Veröffentlichung: | KIT Scientific Publishing, 2023 |
Medientyp: | E-Book |
Umfang: | 220 |
ISBN: | 978-3-7315-1288-2 (print) |
DOI: | 10.5445/KSP/1000156532 |
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