Semiconductor Packaging
Taylor & Francis; CRC Press, 2012
Online
E-Book
- 216
In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages.
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Semiconductor Packaging
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Autor/in / Beteiligte Person: | Chen, Andrea ; Lo, Randy Hsiao-Yu |
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Veröffentlichung: | Taylor & Francis; CRC Press, 2012 |
Medientyp: | E-Book |
Umfang: | 216 |
ISBN: | 978-1-4398-6207-0 (print) |
DOI: | 10.1201/b11260 |
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